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Wafering service
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Wafering service
aWe provide SiC ingot processing and SiC wafering service:
ü 6-8 inch SiC ingot surface grinding, edge grinding, orientation
ü 6-8 inch SiC ingot slicing
ü 6-8 inch SiC wafer lapping, polishing, CMP
ü 6-8 inch SiC wafer grinding
ü 6-8 inch SiC wafer reclaim
For more information, do not hesitate to contact us.
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