Wafering service

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Wafering service

aWe provide SiC ingot processing and SiC wafering service:

ü 6-8 inch SiC ingot surface grinding, edge grinding, orientation

ü 6-8 inch SiC ingot slicing

ü 6-8 inch SiC wafer lapping, polishing, CMP

ü 6-8 inch SiC wafer grinding

ü 6-8 inch SiC wafer reclaim

For more information, do not hesitate to contact us.

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